iPhone 7 傳新間諜照,電路板長這樣

作者 | 發布日期 2016 年 08 月 09 日 11:20 | 分類 Apple , iPhone , 零組件 follow us in feedly
Customers hold the iPhone 6s during the official launch at the Apple store in central Sydney, Australia, September 25, 2015. The new iPhone 6s and 6s Plus arrive in stores and at consumers' doorsteps on Friday, kicking off a sales cycle that will be scrutinized for signs of how much juice Apple's marquee product has left. Apple has a tough act to follow after the success of the iPhone 6, but sales are expected to benefit this year from the inclusion of the Chinese market, where the gadget's debut was delayed in 2014 due to regulatory issues.     REUTERS/David Gray - RTX1SCN7

蘋果(Apple)iPhone 7 再傳出最新間諜照。資深科技達人在中國微博上貼出數張據稱是 iPhone 7 印刷電路板的外洩照,這是首次據稱是 iPhone 7 的電路板照片曝光。

資深 3C 達人「@GeekBar 創始人磊哥」在中國微博上貼出數張據稱是 iPhone 7 印刷電路板的間諜照。此外,「重慶銘廣科技」也在微博上貼出數張據稱是 iPhone 7 印刷電路板的外洩照,引起國外媒體和中國科技網站熱烈討論。法國科技消息爆料達人漢莫史多福(Steve Hemmerstoffer)也在推特 @stagueve 上轉貼相關間諜照。



「@GeekBar 創始人磊哥」指出,從照片來看,A10 處理器比較以往的系統單晶片(SoC)變化很大,基頻晶片結構也有變化。

外界普遍推測,第三季即將推出的 iPhone 7 系列,將內建蘋果新款 A10 處理器,採用台積電 16 奈米製程技術,由台積電獨家代工。



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