台積電（TSMC）提升 ASML 極紫外光（EUV）曝光機效率取得重大進展，2019 年以來，台積電以系統級最佳化及自研薄膜材料，使 EUV 生產晶圓產量增加 30 倍，同時電力消耗減少 24%。身為全球最大 EUV 用戶，台積電有約 200 台機台，2024~2025 年再新增 60 多台，支撐先進製程擴產需要。
台積電核心優勢來自硬體設備及材料供應鏈掌控力，甚至計畫改造一座200公釐工廠專門生產自研EUV薄膜，性能超過ASML原廠，展現台積電製程與材料整合實力。薄膜壽命增加四倍，單片晶圓產能提升4.5倍，瑕疵品大幅降低。
2019年首次於華為麒麟9000處理器導入EUV後，台積電控制全球超過42%~56%的EUV機台裝機量，且持續投資最佳化製程，包括曝光劑量微調、曝光材料改良及預測性維護，大幅提升每日機台利用率與生產效率。這些成果為即將量產的2奈米提供堅實基礎，持續鞏固台積電的全球半導體代工龍頭地位。
將來台積電聚焦新曝光材料與製程，並配合即將量產的高數值孔徑（High-NA）EUV系統，繼續引領產業革新。
- How TSMC managed to increase efficiency of ASML’s EUV tools: System-level optimizations and in-house pellicles —chipmaker boosted EUV-driven wafer production by 30x over six years while reducing power consumption by 24%
- TSMC plans to expand production with a 400 billion silver bullet and buys EUV. These Taiwanese manufacturers are extremely excited.
- TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
- ASML ships first High-NA EUV tool; Intel takes lead as TSMC, Samsung hold back-Flytronics All rights reserved.
- TSMC to Begin 2nm Chip Production in 2025 — What It Means for Apple, NVIDIA, and the Chip Industry
- Nvidia, TSMC and ASML – Three Companies That Won’t Have Significant Competition For the Next 5 Years
- TSMC Reportedly Invests over USD 12.3 Billion in EUV, Advancing in 2nm Production
（首圖來源：台積電）
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